iFixit recently took on the formidable challenge of disassembling the Apple Vision Pro, a task that required immense perseverance. Their efforts paid off as they successfully revealed the internal components, including the logic board housing the M2 chipset and the intriguing R1 co-processor. This co-processor plays a vital role in delivering a seamless experience with visionOS, Apple’s proprietary operating system designed for visual tasks.
Interestingly, speculation has arisen regarding Apple’s potential utilization of a chiplet design for the R1 silicon. This speculation was sparked by an astute observer who noticed certain distinguishing features in the packaging of the M2 and R1 chips. Upon close examination of the images provided by iFixit, one can observe a notable difference in the packaging of the two chipsets. Yining Karl Li was the first to highlight this distinction, pointing out the presence of distinct horizontal and vertical lines in the packaging of the R1, a characteristic typically associated with chiplet designs.
However, opinions on this matter are divided, with some expressing skepticism about the possibility of the R1 employing a chiplet design. One commenter proposed an alternative explanation, suggesting that the differing packaging appearance of the R1 could be due to the incorporation of low-latency fan-out memory. This alternative explanation could account for the observed differences in texture between the two chipsets.
Nevertheless, Yining’s inquiry is valid, particularly considering the noticeable differences in texture between the M2 and R1 chipsets. Given the potential advantages of a chiplet approach, it is not unreasonable to speculate about Apple’s future endeavors in launching custom System-on-Chips (SoCs) featuring such a design.
A chiplet design offers several benefits, including the ability to integrate components such as the CPU, GPU, and NPU onto a single die by leveraging various nodes. This approach significantly reduces development times and costs by incorporating pre-developed dies within an Integrated Circuit (IC) package. Essentially, Apple could utilize a diverse array of modular dies tailored for different tasks, enhancing versatility and efficiency in their chip design strategies.
Based on the available information and visual evidence, the question of whether the Apple Vision Pro’s R1 co-processor utilizes a chiplet design remains open to interpretation. However, the possibility raises intriguing prospects for the future of Apple’s silicon architecture.
We invite readers to share their thoughts and insights on this topic in the comments section below. The speculation surrounding Apple’s chiplet design is an exciting subject that sparks curiosity and fuels discussions about the future of technology.
